Where we are & what we doBased in Deeside, North Wales (UK), RAM Innovations was established to provide services & products to the semiconductor & electronics industries.
Our purpose built 1000 sq. metre development facility is comprehensively equipped with die placement/bonding, metallographic & chemical laboratories along with sophisticated state-of-the-art manufacturing equipment for laser direct imaging, lamination, sequential build-up embedding & CNC machining . Our wet chemistry development area houses our metallisation, metal plating & chemical milling capability.
Our core specialities are:-•Semiconductor package development
•High complexity HDI printed circuits in composite constructions
•Converging technologies (PCB, semiconductor packaging, photovoltaics, printable electronics, embedded components, optoelectronics)
• Manufacturing solutions
• Multi partner collaborations (customer, materials & equipment manufacturers, academia)