Careers

RAM Innovations provides next generation R&D and manufacturing services to the global electronics industry. We specialise in Heterogeneous packaging of semiconductors using techniques with their roots in the PCB manufacturing and semiconductor industries. These processes include chemical processing and plating, die and component placement and sintering. Many of our existing projects are focused on high performance power modules for a range of power electronics applications including aerospace, industrial, automotive, rail and marine. The business is still relatively small and the work is cutting edge, varied and ultimately geared towards Net-Zero objectives.

Role Description

This is a full-time, on-site role for a Research and Development Specialist based at Deeside in North Wales, a few miles from the historic town of Chester. The R&D specialist will work alongside the engineering team conducting research and analysis, developing and implementing new products and processes while disseminating this knowledge through the business. Outside the box thinking is a requirement for this role as we combine the worlds of PCB manufacturing and semiconductor technology to create power dense and efficient power modules at scale.

 Qualifications and skills

• A desire to discover and develop new manufacturing solutions at the frontier of semiconductor packaging with the potential to lead to patented technology.
• Qualifications (or time served) in an Engineering discipline or other relevant fields such as Materials Science and Nanotechnology.
• Understanding of semiconductor and electronics manufacturing processes, particularly Advanced Packaging.
• Understanding of PCB manufacturing processes.
• Strong analytical skills.
• Natural ability to conduct research and work independently and collaboratively.

 Required Competencies and Behaviours

• Strong business acumen.
• Able to work under pressure without compromising on quality.
• Focus on Quality and Results.
• Works effectively with others.
• Treats others fairly with dignity and respect.
• Communicates clearly and accurately.
• Plans and uses time to most effectively accomplish work.
• Uses available information and procedures to make decisions and seeks input from others as appropriate.
• Continuously strives for improvement and production gains.

Please submit written applications to jobs@ram-innovations.com.

Key Roles and Responsibilities

• Process innovative product through a variety of chemical, machining & assembly processes.
• Interpret and apply all drawings, instructions and documentation relating to the manufacturing of embedded chip devices & modules.
• Assemble, hand solder and wire PCB assemblies and units.
• Maintain the process lines in a working & presentable state.
• Maintain working chemical processes through simple lab. Analysis (titration, pH, spectrophotometry.
• Ensure inbuilt quality and inspection of own work.
• Complete any relevant training provided by the company and assist in the training of others where required.
• Timely reporting of any issues or occurrences to the Supervisor.
• Carry out duties in a respectful and efficient manner, acting in the interest of the company at all times and complying with the company rules and regulations, including Health and Safety policies.

Technical Skills

• Previous experience of PCB and electronics manufacture.
• Experience of operating with ESD controls.
• Proficient in the use of Microsoft office.
• IPC-J-STD-001 Soldered Electrical and Electronic Assemblies.

Required Competencies and Behaviours

• Strong business acumen.
• Able to work under pressure without compromising on quality.
• Focus on Quality and Results.
• Works effectively with others.
• Treats others fairly with dignity and respect.
• Communicates clearly and accurately.
• Plans and uses time to most effectively accomplish work.
• Uses available information and procedures to make decisions and seeks input from others as appropriate.
• Continuously strives for improvement and production gains.

Please submit written applications to jobs@ram-innovations.com.

RAM Innovations is a small but fast-growing business at the forefront of developing advanced packaging techniques for the semiconductor industry. Situated on Deeside in North Wales, a ten-minute drive West from the historic city of Chester, the business is in the process of transitioning from a niche R&D business to a manufacturing-oriented business underpinned by a strong R&D base.

RAM has developed a world leading process to embed bare semiconductor dies directly into printed circuit boards, enabling both significant improvements in efficiency and a reduction in the size and weight of power electronics modules. As the world continues its transition towards Net-Zero, smaller and more efficient power electronics are an essential building block to the electrification of all types of transport and many industrial processes.

RAM is already collaborating with a number of aerospace and automotive OEMs and Tier 1 suppliers to develop and manufacture hardware on a commercial basis. We are also continuing to invest in R&D through grant funded collaborations with partners including the Compound Semiconductor Applications Catapult. 

We are actively recruiting to expand the team and are looking for people with a strong technical mindset, who are willing to work with teammates, customers and partners to find solutions and drive the business forward. We have a number of positions opening up in the near future and are interested in hearing from potential colleagues with a broad spectrum of technical experience, ranging from seasoned senior technology leaders, to aspiring junior engineers. 

Qualifications

We are looking for people who have achieved a minimum of HNC or degree level qualifications through education or time served experience. Educational experience within some of the following fields is of particular interest: 

• Mechanical engineering

• Product development

• Electrochemistry

• Process engineering

• Chemical engineering

• Electronics

• Manufacturing 

Experience

In terms of work experience, we are looking for people who are interested in building on their existing skills to develop deep domain knowledge across a number of elements of RAM’s process capabilities. Previous experience of some of the following areas is required: 

• 3D CAD modelling

• PCB manufacturing

• New product introduction processes

• Design for manufacturing

• Use of Gerber files and PCB layout software (Altium)

• Electronics manufacturing

• Material selection

• Manufacturing processes involving chemical and electrochemical processes

• IPC standards relevant to PCB/PCBA design and manufacturing

• Report writing

• Low to mid-volume electromechanical design, assembly and test

• Interaction with customers and partners through R&D projects 

Join us!

• We need team members to be ‘hands on’ and most roles will be a mix of office and lab/shopfloor activities

• We are delivery focused and will only achieve our potential if we follow through on our commitments to our customers and partners

• We are a flexible working employer and are currently experimenting with a 4-day week for manufacturing activities

• As a business that will grow rapidly over the next few years, there will be plenty of opportunities for career development and we will support with funding third party training as required

• Most of all, we are offering team members the opportunity to help build a dynamic UK engineering and manufacturing business that can help accelerate the transition to Net-Zero 

Please send CV and covering letter to: jobs@ram-innovations.com