Our Services
We provide R&D and manufacturing services to semiconductor and electronics producers. This includes flexible product and process development that support a range of scenarios, from one-off samples to long-term highly structured development programs involving your specified materials and equipment suppliers.
Research & Development
Research and development of advanced manufacturing methods to produce PCBs, electronics and electronics packaging.
Advanced and Conventional Manufacturing
Electronics manufacturing capabilities using conventional and advanced methods such as embedded die packaging.
Customer Product Development
Including:
• Comprehensive reporting of all aspects of development, including blind leads and “dead ends”
• Proof-of-concept samples & test vehicles
• Marketing & engineering samples
• Detailed processing requirements & machine specifications/parameters
• Production integration with route to volume production
• Technology training of your own employees
• Hosting facilities for collaborator meetings
Flip Chip development
Advanced Manufacturing
High volume production
Parallel production of EDP modules using large panel (450 x 600mm) format configuration.
Half-bridge building block
• Ceramic substrate
• Integrated gate drives and isolated
supplies
• Integrated DC-link decoupling.
Floating Tile technology
Insert bonding (Floating Tile technology) Aluminium Nitride tiles are bonded within the PCB structure allowing access to both sides of the tile simultaneously.
Conventional Manufacturing
Chip on Board assembly processes being used for an LED lighting application
We offer conventional assembly techniques:
- Wire bonding
- Flip Chip
- Conductive adhesive
- Sintering
- Surface-mount technology (SMT)
Interested in finding out more?
Contact us to see how we can help.
