About Us
RAM Innovations is a bespoke R&D and manufacturing services provider that delivers leading embedded die packaging (EDP) solutions for electronics manufacturing. At our core, we are an organisation of technical professionals that are passionate about helping our customers to unlock the benefits of EDP through the research and development of innovative manufacturing technologies, processes and solutions. With our team of experts in the field we offer the highest level of expertise as well as low-volume manufacturing of EDP with an option to scale up manufacturing volume.
About Us
RAM Innovations is a bespoke R&D and manufacturing services provider that delivers leading embedded die packaging (EDP) solutions for electronics manufacturing. At our core, we are an organisation of technical professionals that are passionate about helping our customers to unlock the benefits of EDP through the research and development of innovative manufacturing technologies, processes and solutions. With our team of experts in the field we offer the highest level of expertise as well as low-volume manufacturing of EDP with an option to scale up manufacturing volume.
Our History
- 2011 – RAM formed to support the international semiconductor industry with advanced packaging techniques.
- 2014 – Infineon engaged RAM as a rapid response R&D capability for embedded PCB technology.
- 2017 – RAM and University of Nottingham developed an embedded PCB cooling structure in an APC “Preparing for the Grand Challenge” program.
- 2018 – RAM, University of Nottingham and The Thinking Pod Innovations (TTPi) awarded Innovate UK funding for a development program to demonstrate the viability of a PCB embedded die packaging process for high current, fast switching, power converters.
- 2019 – RAM, together with INEX Microelectronics and Paragraf, awarded a further Innovate UK funding for project “GRAPHIC-MAN” to develop specialist packaging for Paragraf’s Graphene hall effect sensors.
- 2021 – RAM Innovations is acquired by Nick Russel and secures InnovateUK grant funding to commercialise its embedded die technology while continuing to provide R&D and manufacturing services.
- 2022 – RAM secured additional grant funding and commercial contracts including the delivery of embedded power modules to an aerospace OEM.
- 2023 – Additional investment received and Peter Green becomes a shareholder.
Name of Company
RAM Innovations Ltd
Registered Office
1F Chester Road, Pentre Industrial Estate,
Pentre CH5 2DQ
VAT No.
GB112430472
Regulatory Authority
Registered in England and Wales,
Company Registration No. 7630754
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Contact us to see how we can help.
