by Ram Mohan | May 18, 2022 | News
The embedded die packaging (EDP) technology developed by RAM Innovations Ltd will play an essential role in a game-changing supply chain project that is now underway. The objective of P3EP (Pre-packaged Power Devices for PCB Embedded Power Electronics) is to leverage...
by Ram Mohan | Mar 1, 2022 | News
RAM Innovations has once again been delighted by the results of engaging a team of students from the Institute for Manufacturing (IfM), University of Cambridge, to explore new requirements for in-line production, characterisation and reliability testing equipment and...
by Ram Mohan | Feb 22, 2022 | News
We are pleased to share that RAM Innovations has completed a two-year Innovate UK funded project.The project has been led by Paragraf™, a Cambridge-based graphene semiconductor specialist, and included INEX Microtechnology Ltd, a semiconductor developer and...
by Ram Mohan | Feb 1, 2022 | Archive
We are delighted to announce that Dr Nigel Salter has joined RAM Innovations as General Manager. Over recent months, Nigel has helped develop RAM’s strategy and the integration with Russel Industries. He will now guide the company as it expands to become a valuable...
by Ram Mohan | Aug 27, 2021 | News
Russel Industries has taken further steps to broaden the range of engineering capabilities it can offer. The group – which already comprises contract manufacturer Prima Electronic Services as well as battery and energy storage specialist Denchi – has now...
