Solutions
Integrated Cooling Solution
A flexible integrated modular technology for use in heat harvesting and system cooling of power electronic modules and systems.
The Cooling module is bonded directly to the back side of the IMS or Thick Film Substrate of the power component forming a thermally efficient contact area for heat transfer to a liquid heat recovery system.
Half-Bridge Building Block Solution
An Integrated Power Building for GaN and SiC solutions
Half-bridge building block specification:
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- 500V, 100A
- 30 x 20 x 5 mm
- Ceramic substrate
- Integrated gate drives
- Isolated power supplies
- Integrated DC-link decoupling
- Integrated liquid cooling option
Interested in finding out more?
Contact us to see how we can help.
