Our capabilities
We support your development and manufacturing needs through a range of scenarios, from one off samples, to long term highly structured development programs through to full manufacturing.
Our purpose built 1000 sq. metre facility is comprehensively equipped with die placement/bonding, metallographic & chemical laboratories, along with sophisticated state-of-the-art manufacturing equipment for laser direct imaging, lamination, sequential build-up embedding, and CNC machining. Our wet chemistry development area houses our metallisation, metal plating, and chemical milling capability.
Other capabilities include:
- Sequential build-up embedding
- Chemical and failure analysis
- High volume production using large panel format
- Full surface mount technology (SMT) assembly
- Ceramic and other materials embedded in the core structure
- Intricate connections for integrated gate drivers and other support devices
- Large area, high power, direct connection for power devices including GaN\SiC
- Insert bonding (Floating Tile technology)
- Product evaluation and testing capabilities.
Die placement and bonding
Die Placement
Cammax (manual)
Palomar 3500-II
placement = +/- 15µm
2000 uph
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Die placement and bonding
Die Placement
Cammax (manual)
Palomar 3500-II
placement = +/- 15µm
2000 uph
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Chemical Processing and plating
Surface Finish and Plating
Electrolytic Tin: Solderable finish
3-5µm minimum
Silver: 0.2µm maximum
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Chemical Processing and plating
Surface Finish and Plating
Electrolytic Tin: Solderable finish
3-5µm minimum
Silver: 0.2µm maximum
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Laser direct imaging
Orbotech DP100SL
The use of an LDI (Laser Direct Imaging)
machine enables the production of fine circuit geometry
Minimum 25µm Line/space
PCB Design Data
Gerber
Extended Gerber
(RS-274X)
ODB++
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Laser direct imaging
Orbotech DP100SL
The use of an LDI (Laser Direct Imaging)
machine enables the production of fine circuit geometry
Minimum 25µm Line/space
PCB Design Data
Gerber
Extended Gerber
(RS-274X)
ODB++
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LAMINATION
Burkle Vacuum Press
Platen size: 450 x 610mm
Pressure: 0 – 100 bar
Temperature: 300°C max 350 C
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LAMINATION
Burkle Vacuum Press
Platen size: 450 x 610mm
Pressure: 0 – 100 bar
Temperature: 300°C max 350 C
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Design Evaluation and modelling
3D evaluation modelling
• Altium and Solidworks
• Step
• DXF/DXF
Thermal Modelling
PCB Design Data format
• Gerber
• Extended Gerber (RS-274X)
• ODB++
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Design Evaluation and modelling
3D evaluation modelling
• Altium and Solidworks
• Step
• DXF/DXF
Thermal Modelling
PCB Design Data format
• Gerber
• Extended Gerber (RS-274X)
• ODB++
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machining
Drill / Routing
Schmoll MX1 ccd
High precision drill and rout
machining in single operation.
x/y accuracy ±20µm
z control accuracy 15µm
Data:
Excellon / Sieb & Meyer
NC Data
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machining
Drill / Routing
Schmoll MX1 ccd
High precision drill and rout
machining in single operation.
x/y accuracy ±20µm
z control accuracy 15µm
Data:
Excellon / Sieb & Meyer
NC Data
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Interested in finding out more?
Contact us to see how we can help.
