Technology
RAM Innovations is a bespoke R&D and manufacturing services provider that delivers leading Embedded Die Packaging (EDP) solutions for electronics manufacturing. Our team of experts in the field of EDP, offers the highest level of expertise as well as low-volume manufacturing of EDP with an option to scale up manufacturing volume.
Embedded Die Packaging (EDP)
Semiconductor devices can be embedded within a core structure to create a highly efficient three dimensional component or integrated module. Having the semiconductor device within the structure allows for greater freedom of design. This can include the integration of passive components which can be positioned in close proximity with the primary device. Improved thermal transfer can be achieved due to the device being laminated within the core structure and in close vicinity to the metal layers surrounding it. Heat-sinking components can also be incorporated very close to the primary device. The Shielding effect of the metal layers within the structure can also offer a design advantage. Embedding allows for improved design due to reduction in tracking connection lengths resulting in improved package efficiencies and reduced parasitics. Embedded die packaging can be used for developing very small packages, modules and system-in-boards (SiBs), for a variety of applications.
Key features of Embedded Die Packaging
- Improved package efficiency
- Improved design parameters – enables more space for other components or shrinks overall solution
- Integration of passive components
- Reduced manufacturing cost
- Improved thermal conductivity – Lower electrical & thermal resistivity in package improves power performance
- Shielding capabilities
- Reduced parasitics – reduction in tracking connections (interconnections) lengths reduce distortion and power loss
- Increased mechanical system stability due to stable Cu interconnections
- Elimination of bond wires.
EDP Examples
Copper power interconnect directly plated onto GaN die
ASIC device embedded within the core substrate
60A Embedded GaN power devices silver sintered to Copper pattern on lower ceramic layer of structure
Ceramic and other materials embedded in the core structure
Simplified Embedding Process
Core substrate
By using a core platform approach to manufacture means that the design can be very adaptable to a wide range of applications.
Die apertures and first stage copper interconnection are produced during the core substrate manufacture.
Die placement
Semiconductor devices are placed in the core substrate apertures. The Core platform technology allows for the devices to be placed in both up and down orientations at the same time, increasing design flexibility.
Die attach
Die attach material is applied and cured, securing components within the core substrate.
Device Connection
Interconnection tracking is generated to complete the device connection. The majority of our work has used photo imaging techniques, although non-photo definable materials with laser ablation can be used if required.
Large area interconnection
Photo imaging techniques allows for large area interconnection tracking to be created to maximise thermal and electrical performance.
Dielectric build-up
Dielectric build-up to isolate devices before further build
up processing.
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